Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors
Conductive Layer: Thick Copper Layer
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  • Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
  • Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
  • Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
  • Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
  • Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
  • Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Find Similar Products
  • Overview
  • Product Description
  • Product Gallery
  • Standard Product Sizes
  • Certifications
  • Production & Advantages
  • Packaging & Shipping
  • Our Reputable Customers
  • FAQ
Overview

Basic Info.

Model NO.
WTK-Substrate
Material
AlN
Process
Direct Bonded Copper
Thickness
0.25, 0.32, 0.38, 0.5, 0.635, 0.76, 1, 2mm
Density
3.33G/Cm3
Color
Grey
Flexural Strength
450 MPa
Thermal Conductivity
>180 W/M.K
Dielectric Strength
>20 Kv/mm
Type
Ceramic Plate
Transport Package
Carton, Wooden Box, Pallet
Specification
Customized
Trademark
WINTRUSTEK
Origin
Fujian, China
HS Code
8547100000
Production Capacity
50000 Pieces/Month

Packaging & Delivery

Package Size
30.00cm * 30.00cm * 30.00cm
Package Gross Weight
15.000kg

Product Description

Product Description

Ceramic Substrates are materials that are commonly used in power modules. They have unique thermal, mechanical, and electrical properties that make them ideal for demanding power electronics applications. These substrates enable a system's electrical function while providing mechanical stability and superior thermal performance to meet the unique design requirements.

Typical Materials

96% Alumina (Al2O3)
99.6% Alumina (Al2O3)

Beryllium Oxide (BeO)

Aluminum Nitride (AlN)
Silicon Nitride (Si3N4)

Typical Processing

As fired

Grinded

Polished
Laser Cut
Laser Scribed

Typical Metallization Direct Bonded Copper (DBC)
Direct Plated Copper (DPC)
Active Metal Brazing (AMB)
Mo/Mn Metallization and Metal Plating

 

Product Gallery

Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
 
    Laser-cut Alumina Ceramic Substrate   As-fired AlN Ceramic Substrate              Double Sides Polished AlN Ceramic Substrate
 
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
    Hot Pressed Black AlN Ceramic Substrate Laser-cut AlN Ceramic Substrate            Silicon Nitride Ceramic Substrate       
 
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
 
   DBC Ceramic Substrate                   DPC Ceramic Sustrate                 Mo/Mn Metallized BeO Ceramic Substrate
 

Standard Product Sizes

Material Standard Size (mm) Standard Thickness (mm)
96% Al2O L240xW140 L190xW140 L150xW130 0.254, 0.381, 0.508, 0.635, 0.762, 1.0, 1.5, 2.0
L120xW120 L114xW114 L101.6xW101.6
99.6% Al2O3  L50.8xW50.8 L76.2xW76.2 L101.6xW101.6 0.127, 0.254, 0.381, 0.508, 0.635, 0.762, 1.0
D100 D152.4  
BeO L50.8xW50.8 L76.2xW76.2 L101.6xW101.6 0.381, 0.5, 0.635, 1.0, 1.5, 2.0, 2.5
L114.3xW114.3 D20, D26, D30, D35, D50 D52, D60, D75, D100, D110
AlN L50.8xW50.8 L114.3xW114.3 L120xW120 0.254, 0.381, 0.508, 0.635, 1.0, 1.5, 2.0 
L190xW140 L254xW254 L300xW300
Si3N4 L190xW138     0.32
 

Certifications

Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation

Production & Advantages

Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation

Our Advantages:

1. Many grades of ceramic materials to choose from for your applications.


2. Technical support on consultation, design, and prototypes.

 

3. Fast delivery from prototype to production quantities.
 

4. In-house capabilities in forming, sintering, machining, glazing, metalizing, brazing, and assembly.

5. Our highly trained team of quality assurance staff uses advanced measuring devices to ensure that our products always meet the customers' requirements.

Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation

Packaging & Shipping

Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation

Our Reputable Customers

Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
"It has been over 6 years since your company became our trusted supplier. During all years' requisitions, we were happy with your good quality products and reliable service. Appreciated your previous service with all efforts: patience,  reliability, and responsible quality." --- by CoorsTek, Nov. 2023
 

FAQ

Q: What is your minimum order quantity (MOQ)?
A: Our minimum order quantity (MOQ) depends on many factors such as product, material, dimensions, etc.

Q: Do you provide free samples?
A: Yes, we are pleased to provide a free sample for your initial evaluation of our materials if we have the sample in stock and its cost is bearable.

Q: Do you accept a trial order before a bulk purchase?
A: We welcome your trial order to verify our quality before your bulk purchase.

Q: What is your production time?
A: Our production time depends on materials, dimensions, processing, quantity, etc. Normally, it takes 5-15 days for as-fired substrates, 10-20 days for laser-cut and scribed substrates, and 25-35 days for grinded, polished, and metalized substrates. Please share your specific requirements with us, and we will quote the fastest production time.

Q: What are your payment terms?
A: Our payment terms are T/T, L/C, and PayPal.

Q: What packaging do you use to ensure ceramics are safe?
A: We pack the ceramic products tidily with foam protection inside the carton, plastic box, and wooden box.

Q: Do you accept custom orders?
A: Of course, besides substrates with standard dimensions, we also produce custom substrates according to your requirements for dimensions, structure, surface roughness, and metallization.

Q: Would you provide our order's inspection report and material test certificate?
A: Yes, we can provide these documents upon request.

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