Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate

Product Details
Customization: Available
Application: Electronic Devices
Conductive Layer: Thick Copper Layer
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  • Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
  • Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
  • Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
  • Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
  • Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
  • Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
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  • Overview
  • Product Description
  • Product Gallery
  • Technical Data Sheet
  • Certifications
  • Production & Advantages
  • Packaging & Shipping
  • Our Reputable Customers
  • FAQ
Overview

Basic Info.

Model NO.
WTK-Al2O3
Material
Al2O3
Process
Direct Bonded Copper
Thickness
0.38 mm
Density
3.6 g/cm3
Color
White
Flexural Strength
300 MPa
Compressive Strength
2300 MPa
Thermal Conductivity
20 W/M.K
Dielectric Strength
>15 Kv/mm
Purity
95%
Type
Ceramic Tube
Transport Package
Carton, Wooden Box, Pallet
Specification
Customized
Trademark
WINTRUSTEK
Origin
Fujian, China
HS Code
8547100000
Production Capacity
5000 Pieces Per Month

Packaging & Delivery

Package Size
15.00cm * 15.00cm * 10.00cm
Package Gross Weight
1.000kg

Product Description

 

Product Description


Ceramic metallization is a specialized process that involves the deposition of a metallic layer onto the surface of a ceramic substrate, enhancing its wettability for subsequent brazing applications.

The procedure typically begins with thorough cleaning and preparation of the ceramic surface. This is followed by the application of a metallization coating, comprised of a blend of molybdenum/manganese or molybdenum/manganese/tungsten, using techniques such as needle painting, brushing, spraying, or screen-printing, and then sintering the coated ceramic to permanently bond the metal layer. The final product is a component that is ready for brazing into a hermetic assembly.
 

Ceramic Type Metallization Type
Beryllium Oxide Mo-Mn Method
Alumina Mo-Mn Method
Direct Bonded
Copper method (DBC)
Nickel Plating
Aluminum Nitride Direct Bonded Copper method (DBC)
Direct Plating Copper (DPC)
Active Metal Brazing (AMB)


Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate

Product Gallery

Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate    

Technical Data Sheet

 
Properties
Material
DBC
AMB
Thermal Conductivity (W/m·K)
Al2O3 20-24 N/A
AlN 130-200 170-220
Copper Layer Thickness (μm) Al2O3 100-300 100-300
AlN 100-300 100-300

DISCLAIMER: The given data are not binding but are typical values based on sample testing. It should be taken into consideration that a spread of results can arise due to variations in material, shape, size and production.
 

Certifications

Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate

Production & Advantages

Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate

Our Advantages:

1. Many grades of ceramic materials to choose from for your applications.


2. Technical support on consultation, design, and prototypes.

 

3. Fast delivery from prototype to production quantities.
 

4. In-house capabilities in forming, sintering, machining, glazing, metalizing, brazing, and assembly.

5. Our highly trained team of quality assurance staff uses advanced measuring devices to ensure that our products always meet the customers' requirements.

Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate

 

Packaging & Shipping

Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate

Our Reputable Customers

Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate

"It has been over 6 years since your company became our trusted supplier. During all years' requisitions, we were happy with your good quality products and reliable service. Appreciated your previous service with all efforts: patience,  reliability, and responsible quality." --- by CoorsTek, Nov. 2023

FAQ

Q: What is your minimum order quantity (MOQ)?
A: Our minimum order quantity (MOQ) depends on many factors such as product, material, dimensions, etc.

Q: Do you provide free samples?
A: Yes, we are pleased to provide a free sample for your initial evaluation of our materials if we have the sample in stock and if its cost is bearable to us.

Q: Do you accept a trial order before a bulk purchase?
A: Yes, we welcome your trial order to verify our quality before your bulk purchase.

Q: What is your production time?
A: Our production time depends on materials, production methods, tolerances, quantity, etc. Normally, it takes 15-20 days if we have stock material, and it takes 30-40 days if we don't. Please share your specific requirements with us, and we will quote the fastest production time.

Q: What are your payment terms?
A: Our payment terms are T/T, L/C, and PayPal.

Q: What packaging do you use to ensure ceramics are safe?
A: We pack the ceramic products tidily with foam protection inside the carton, plastic box, and wooden box.

Q: Do you accept custom orders?
A: Of course, most of our orders are custom products.

Q: Would you provide an inspection report and material test certificate for our order?
A: Yes, we can provide these documents upon request.

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